239000002002 slurry Substances 0.000 title claims abstract description 52.Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Priority to US09/461,158 priority Critical patent/US6825117B2/en Application filed by Intel Corp filed Critical Intel Corp Priority to US10/917,729 priority patent/US6909193B2/en Publication of US20050017367A1 publication Critical patent/US20050017367A1/en Application granted granted Critical Publication of US6909193B2 publication Critical patent/US6909193B2/en Anticipated expiration legal-status Critical Status Expired - Fee Related legal-status Critical Current Links Original Assignee Intel Corp Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) Daniel Feller Kenneth Cadien Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Expired - Fee Related Application number US10/917,729 Other versions US20050017367A1 Google Patents High pH slurry for chemical mechanical polishing of copperÄownload PDF Info Publication number US6909193B2 US6909193B2 US10/917,729 US91772904A US6909193B2 US 6909193 B2 US6909193 B2 US 6909193B2 US 91772904 A US91772904 A US 91772904A US 6909193 B2 US6909193 B2 US 6909193B2 Authority US United States Prior art keywords slurry copper polishing polish present Prior art date Legal status (The legal status is an assumption and is not a legal conclusion. Google Patents US6909193B2 - High pH slurry for chemical mechanical polishing of copper US6909193B2 - High pH slurry for chemical mechanical polishing of copper
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